3538003O5WZMS9H0UL10

ＮＥＸＴ　ＦＵＮＤＳ　Ｓ＆Ｐ　５００　半導体・半導体製造装置３５％キャップ指数連動型上場投信

Open-source customer due diligence on ＮＥＸＴ　ＦＵＮＤＳ　Ｓ＆Ｐ　５００　半導体・半導体製造装置３５％キャップ指数連動型上場投信, anchored on its Legal Entity Identifier. The reference data below comes from the GLEIF Golden Copy; a full OpenCheck runs live checks across 30+ open data sources — company registries, sanctions and watchlists, beneficial ownership registers and investigative datasets — mapped to the Beneficial Ownership Data Standard (BODS).

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Legal Entity Identifier

3538003O5WZMS9H0UL10

Legal jurisdiction

JP

Legal form

9999

Registered address

東京都 港区, Japan

Entity status

Active

LEI registration

Issued

LEI first registered

2025-03-24

Record last updated

2026-03-24